Looking for a quick, affordable way to prototype and produce low-volume custom chips? chipIgnite is your ideal solution. We offer custom chips tailored to your needs using open-source tools, reference designs, and automated workflows. Designed for ease of use, our platform requires no IC design experience.
Benefits
A complete chip design with a RISC-V core for hosting your design
For implementing your design hosted inside the chip
Large area within the chip for hosting your design.
Flexibly configurable supporting digital and analog signals
Fully assembled QFN or WCSP parts. Pre-designed to match the chip IO pads
Your parts assembled on pre-designed evaluation boards ready to test
Sample firmware, programming utilities and a test framework to jumpstart your testing.
Use commercial EDA tools to implement your project or sub-project macros. Open-source tools can still be used for the final integration and assembly.
Software Developer / Product Designer
Embedded / FPGA Designer
SoC or Mixed-signal ASIC Designer
Show step by step how to get started.
If you haven't already, register for a free account on the Efabless platform. You can use LinkedIn, Google or Github credentials to login.
If you want to setup a company account, contact us...
Select the shuttle you want to target for your project. Each shuttle has its own project submission deadline and schedule for delivering parts. Each shuttle provides different packaging and part counts.
Create a project for the shuttle as a placeholder and pay a $200 deposit to reserve your space.
Start by cloning the example project from our Github repo here. Follow the documentation to replace the example with your digital design. Implement your design using the open-source design flow included with the project.
You can also clone one of the projects for a library of open-source community designs.
Or use commercial design tools to implement your design and integrate it with the reference chip.
Update your project on the Efabless platform. Submit a precheck job for your project to make sure it meets all the criteria for final assembly and fabrication.
With a successful precheck, now submit a final 'tapeout' job to build the final chip layout for your project. Mark your project as complete and you are ready to go.
After fabrication, we will package dies for your project and assemble some of your parts on evaluation boards for testing. We ship both packaged parts and boards to you.
If you need bare dies, contact us to see what might be possible.
Once you have your parts and boards, clone our open-source repo to get diagnostics and tools for programming the flash as well as firmware and software test frameworks to jumpstart testing your project and developing firmware.
CI 2404 | CI 2406 | CI 2409 | CI 2411 | |
---|---|---|---|---|
Engineer Samples | 100 QFN | 100 QFN | 100 QFN | 100 QFN |
Evaluation Boards | Yes | Yes | Yes | Yes |
Tapeout Date | April 24, 2024 | June 3, 2024 | September 16, 2024 | November 11, 2024 |
Delivery Date | September 20, 2024 | November 1, 2024 | February 14, 2025 | April 11, 2025 |
Bare Die Option | Yes | |||
Reram Support | ||||
Request Quote | Request Quote | Request Quote | Request Quote |
Check the Status for Shuttles in Fabrication